ABOUT EVENT

This Laboratory Training workshop is the second consecutive year of this successful event, co-organized by CMTI (Central Manufacturing Technology Institute), ISSS (Institute of Smart Structures and Systems), and STARC (Semiconductor Technology and Applied Research Centre).

Last year’s workshop received favourable feedback, motivating us to conduct this training again. In 2023, we had a 5-day workshop with over 45 participants, 19 Keynote lectures, and 8 Eyes-ON and Hands-ON sessions on semiconductor and microsystems packaging.

This year’s workshop will have more focus on the Eyes-On and Hands-On laboratory sessions with a few very important keynote sessions.

Several packaging techniques viz., dicing, wire bonding, wafer bonding, flip chip, electrodeposition, e-beam welding, bond testing, electrical characterization, leak tests etc., are covered during the laboratory sessions.
This year’s workshop is also being organized as a pre-conference event to the International Conference on Micro, Nano and Smart Systems (IC-MNSS-2024), which will be held in Bengaluru from July 6-9, 2024.

We believe this training will provide valuable insights and hands-on experience to attendees. The workshop will cover various aspects of semiconductor packaging, including:

Semiconductor packaging technologies

Emerging trends in packaging

Eyes-on and Hands-on sessions on packaging tools and techniques

Networking opportunities with industry experts and researchers

We encourage you to take advantage of this unique opportunity to enhance your knowledge and skills in semiconductor packaging as it just precedes the IC-MNSS 2024.

Seats are limited, so please register early to secure your spot. ISSS members get a discount on the registration fee.

For more information and registration details, please refer to the brochure or contact us at csvtc.cmti@gmail.com.